Izizathu kunye nezisombululo zeChip Jumping ye-Die Scrap kwiNkqubo yeSitampu se-Hardware

Oku kubizwa ngokuba kukutsiba kwe-scrap kubhekiselele kwinto yokuba i-scrap inyukela kumphezulu wokufa ngexesha lenkqubo yokunyathela.Ukuba awuhoywa ngqalelo kwimveliso yesitampu, i-scrap ephezulu inokutyumza imveliso, inciphise ukusebenza kakuhle kwemveliso, kwaye yonakalise ukungunda.

Izizathu zokutsiba i-scrap ziquka:

1. Icandelo elithe tye eludongeni lomgca wokusika lifutshane kakhulu;

2. Uxinzelelo olubi lwe-vacuum lwenziwa phakathi kwezinto kunye ne-punch;

3. Ithempleyithi okanye ipunch ayikhutshwanga zimagnethi okanye i-demagnetization ayilunganga;

4. Ifilimu yeoli yenziwe phakathi kwepunch kunye nemveliso;

5. Inqindi lifutshane kakhulu;

6. Ukukhutshwa okugqithisileyo okungenanto;

Okanye ezi zizathu zingasentla zisebenza ngaxeshanye.

Ukutsiba kwe-scrap, sinokuthatha la manyathelo alandelayo:

1. Ukuba kuvunyelwe, ukwandisa ubude becandelo elithe tye kwi-edge edge ephantsi ngokufanelekileyo;

2. I-punch kunye ne-formwork iya kwenziwa demagnetized ngokupheleleyo phambi kofakelo kunye nokudibanisa;

3. Ukuba kuvunyelwe, i-punch ingenziwa kwi-slant blade okanye yongezwe nge-blowhole.Ukuba ibhetshi yemveliso inkulu, i-punch yomzali ingasetyenziselwa ukuvala;

4. Ngexesha lokuyila, ukukhutshwa okufanelekileyo okungenanto kuya kukhethwa kwizinto ezahlukeneyo.Ukuba kusekho ukutsiba kwezinto, ukukhutshwa kunokunciphisa ngokufanelekileyo;

5. Ingqalelo kufuneka ihlawulwe kubunzulu be-punch kwi-edge edge ephantsi.Ukuba kuyimfuneko, yongeza ubude bepunch.